How are Aluminium PCBs made?
First, of course, machining.
The Aluminum base board can be drilled, but no burrs are allowed on the edge of the hole after drilling, which will affect the withstand voltage test. Milling the shape is very difficult. The punching shape requires the use of advanced molds, and the mold making is very skillful, which is one of the difficulties of the Aluminum LED board. After the contour is punched, the edges are required to be very neat, without any burrs, and not to damage the solder mask on the edge of the board. Normally, using a military maneuver, the hole is punched from the circuit, the shape is punched from the aluminum surface, and communication PCB board is punched with upward shear and downward force. These are all techniques. After punching the shape, the warpage of the board should be less than 0.5%.
Second, the production process.
The entire production process of Aluminum 3.0W LED board production is not allowed to wipe the aluminum base surface, because the surface of the Aluminum 2.0W LED board will be discolored and blackened when touched by hands or through certain chemicals. This is absolutely not allowed. Re-polishing Some aluminum substrates are not allowed, so the whole process does not scratch or touch the aluminum substrate is one of the difficulties in producing aluminum substrates.
Finally, the high voltage test.
Generally, the aluminum substrate of the communication power supply requires 100% high voltage test, some require direct current, some require alternating current, the voltage requires 1500V, 1600V, the time is 5 seconds, 10 seconds, and 100% buile-up printed board is tested. Dirt, holes, burrs on the edge of the aluminum base, line sawtooth, and scratches on the surface of the aluminum substrate will cause fire, leakage, and breakdown in the high voltage test. Delamination and blistering of the pressure test board are not allowed.
