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What is the use of copper clad laminate?
High Quality Prototype PCB Fabrication must use high quality materials. High frequency board and Rigid-Flex Board are to use high-quality substrates for production, and copper clad laminates are used as learning materials. Copper clad laminate (also known as base material) is a plate-like material formed by impregnating a reinforcing material with resin, one or both sides with copper foil, and then hot pressing, called a copper clad laminate. It is the basic material for PCB, often called substrate. When it is used in the production of multilayer boards, it is also called core board (CORE).
What is the use of copper clad laminate
Used to make integrated circuits
How is the copper of the copper clad laminate made up?
The copper clad laminate is through bonding and hot extrusion processes, so that a certain thickness of copper foil is firmly covered on the insulating substrate. The substrate material and thickness of the copper clad laminate used are different.
Is the copper clad laminate a pcb board?
PCB is not the same as copper clad laminate. Copper Clad Laminate refers to a sheet with copper foil coated on one or both sides of a glued board. It is one of the raw materials for making single-sided PCB or double-sided PCB.
Classification of copper clad laminates
1. According to the mechanical rigidity of the copper clad laminate, it can be divided into rigid copper clad laminate (RigidCopperCladLaminate) and flexible copper clad laminate (FlexibleCopperCladLaminate).
2. According to different insulating materials and structures, it can be divided into organic resin-based copper clad laminates, metal-based copper clad laminates, and ceramic-based copper clad laminates.
3. According to the thickness of the copper clad laminate, it can be divided into thick plates (the thickness range is 0.8~3.2mm (including Cu)) and thin plates (the thickness range is less than 0.78mm (excluding Cu)).
4. According to the reinforcing material of the copper clad laminate, it is divided into glass cloth-based copper clad laminate, paper-based copper clad laminate, and composite-based copper clad laminate (CME-1, CME-2).
5. Divided into flame-retardant boards according to the flame-retardant grade
(Flame resistant PCB) and non-flame retardant boards: According to UL standards (UL94, UL746E, etc.), the CCL flame retardant grades are divided, and rigid CCL can be divided into four different flame retardant grades: UL-94V0 grade ; UL-94V1 level; UL-94V2 level and UL-94HB level.
Generally speaking, the copper clad laminates that have reached the flame retardant HB level are tested according to UL standards, which are called non-flame retardant boards (commonly known as HB boards). The copper clad laminate that meets the combustibility requirements of the vertical combustion method in the UL standard (the best flame retardant property is UL-94V0) is called the flame retardant board (commonly known as V0 board). The popular names of "HB board" and "V0 board" are very popular in our country's classification of paper-based copper clad laminates. In the flexible copper clad laminate, due to the difference in the method of determining the flame retardancy, when it reaches the best flame retardant rating required by UL94, it is represented by UL94-VTM-0 level (equivalent to UL-94V0 of rigid CCL) class).
6. According to some properties of copper clad laminates, it is divided into high Tg boards (Tg≥170℃), high dielectric performance boards, high CTI boards (CTI≥600V), environmentally friendly copper clad laminates (halogen-free, antimony-free), ultraviolet light Shielded copper clad laminate.