0 Piece,Product Price: US $ 0
Quantity(Piece/Pieces) | 1 ~ 1000 | >1000 |
Est. Time(days) | 4 | To be negotiated |
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What is Rogers board?
Let's take Rogers' newer product RO4000 series high frequency board as an example to introduce the characteristics of Rogers's high-frequency board. The characteristics of Rogers PCB high frequency buile-up printed board are: non-PTFE, low loss, low tolerance and excellent high-frequency performance, stable electrical characteristics at different frequencies, low dielectric constant temperature coefficient, low Z-axis thermal expansion coefficient, low internal expansion coefficient , Excellent dimensional stability, easy to mass production.
Rogers RO4000 high-frequency board material: It is composed of glass fiber reinforced hydrocarbon/ceramic substrate (non-PTFE), designed for the high-performance, high-volume commercial market. RO4000 series materials are characterized by high frequency performance and low production cost of stamped printed wiring board . It has low loss and similar processing technology to ordinary epoxy resin/glass woven cloth (FR4), so it has a strong price competitiveness.
Rogers RO4000 high-frequency board has stable performance: when the working frequency of the PCB circuit is above 500MHz, the range of materials that design engineers can choose is greatly reduced. Roger 4350 printed board materials allow RF engineers to conveniently design Ro4350B+FR4 hybrid Board , such as repeated design of filters, network matching, and impedance control of transmission lines. Due to its low dielectric loss characteristics, in high-frequency applications, RO4000 series materials are more unmatched by ordinary circuit materials. Its dielectric constant temperature coefficient is almost the lowest among similar materials, and its dielectric constant is also quite stable in a wide frequency range. This makes the material suitable for broadband applications.
Roger 4003 printed board has a low coefficient of thermal expansion: The coefficient of thermal expansion (CTE) of RO4000 series materials also brings many benefits to PCBA circuit designers. Since its thermal expansion coefficient is similar to that of copper, it can provide excellent dimensional stability. This is particularly important for multilayer circuit design. Even in severe thermal shock applications, the low Z-axis CTE expansion coefficient of RO4000 series materials ensures the quality of the through holes in the board.