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What is a buried via?
With the current design of portable products moving towards miniaturization and high density, PCB design is becoming more and more difficult, and higher requirements are put forward for the PCB production process. In most of the current portable products, the Surface-Mount (SMT) & BGA Assembly with a pitch of less than 0.65mm all use the blind and buried via design process, so what is the blind and buried via?
D: Blind hole (L1-L3)