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  • 0 Piece/Pieces $ 0
  • ship to United States To Be Negotiated $ /
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    After payment is complete, your order will ship within
  • Shipping time / days
    Estimated Delivery Time is the time between your package shipped out of carriers’ warehouses and final destination delivery. Estimated delivery time does not include supplier manufacturing lead time, holidays and weekends.
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Prototype PCB-Assembly with quick delivery
  • Prototype PCB-Assembly with quick delivery
  • Prototype PCB-Assembly with quick delivery
  • Prototype PCB-Assembly with quick delivery
  • Prototype PCB-Assembly with quick delivery
  • Prototype PCB-Assembly with quick delivery
  • Prototype PCB-Assembly with quick delivery
  • In Stock
  • Ready to Ship
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Prototype PCB-Assembly with quick delivery

  • $0.5
    ≥1
    Piece/Pieces
1 Piece/Pieces (Min. Order)
Quantity:

0 Piece,Product Price: US $ 0

  • Lead Time:/ days
  • Shipping time:/ days
Sample:
$5.00 /Piece/Pieces, 1 Piece/Pieces (Max. Order)Buy Samples
  • Product Description
Overview
Product Attributes
Model No.:
PCB Assembly DH008
place of origin:
China
Number of layers:
4-Layer, 6-Layer, 8-Layer, 10-Layer, 12-Layer
Min SMT Package:
0.201
Min IC pitch:
0.4mm
Max BGA size:
70*70mm
BGA ball pitch:
1.00 To 3.00mm
BGA ball diameter:
0.4 To 1.0mm
Surface Finishing::
Hal,Enig,Immersion Tin/Sliver
Testing Service::
Aoi X-Ray Function Test
Certificate::
Iso9001/Iatf16949/Iso13485
QFP lead pitch:
0.4 To 2.5mm
Packaging & Delivery
Selling Units:
Piece/Pieces
Single package size:
15cm*15cm*25cm
Single gross weight:
2kg
Package Type:
Vacuum and ESD Package
Picture Example:
Lead Time :
Quantity(Piece/Pieces) 1 ~ 2000>2000
Est. Time(days) 3To be negotiated

If you finish the payment today, your order will ship out within the delivery date.

How does PCB assembly process work?

Printed circuit board assembly, also known as PCBA , is the process of soldering or PCBA Manufacturing of electronic components to a PCB or printed circuit board.

Be sure to include the board revision and other identifiers, such as the release date, to clearly distinguish the design.

Specify the level of IPC (or other standard) inspection required.

Specify solder alloy requirements, especially if the RoHS standard must be met.

Specify any components or areas of the circuit board that require special attention, such as polarization, moisture sensitivity, and restricted areas.

Ensure any process or readability requirements. Silkscreen includes reference indicators, labels and markings.

Make sure that the package on the PCB layout is accurate for your MPN. List of BOM components.

Including component riveting (before SMT), underfill, material and hardness requirements.

Including washing, cleaning, conformal coating and encapsulation.

Ensure that the image is comprehensive and include any mechanical hardware additions, such as heat sinks and radiation shielding elements.

Clearly specify any additional processes, such as drying or functional testing.

Including sub-board instructions.

Following the practices outlined in the list above will help facilitate the construction of circuit boards while ensuring that they meet your reliability and performance goals. And to ensure that your instructions meet the needs of your CM, you should follow the PCB design and development checklist,

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