What is a hybrid microwave integrated circuit?
Microwave radio frequency board is a hybrid microwave integrated circuit (HMIC) which is a complex technology developed by MACOM. This technology can combine two different materials (glass and silicon) into a single monolithic structure. This technology can integrate the best properties of each material, thereby helping to achieve a monolithic circuit solution with size and cost advantages. HMIC should be regarded as an auxiliary technology of GaAs and silicon MMIC technology. HMIC focuses on the use of automated batch manufacturing and testing technology to produce resistance, reactance and lumped components with small size and low loss characteristics for high-performance microwave integrated circuits. This technology is suitable for wafer-level manufacturing. It can not only effectively break through the size, cost and performance limitations, but also significantly improve the reliability and reliability of traditional Electronic Components, active, passive, high frequency mixing pressure plates, and chip fine-line microwave circuits. Repeatability.
1. High cost performance
2. Improved reliability and repeatability
3. Broadband performance can be achieved
4. Make the manufacturing of High frequency board more flexible
5. Utilize the excellent properties of glass and silicon at the same time: glass-low dielectric constant and high frequency loss tangent; silicon-high thermal conductivity and low resistance
Main applications: CATV and wired broadband, wireless backhaul, industrial, scientific and medical, test and measurement, chip fine-line high-frequency microwave applications
