What is the advantage of a hybrid integrated circuit?
Hybrid integrated circuits are originality electronics ICs made by combining semiconductor integration processes with thin (thick) film processes. Hybrid integrated circuits are made by forming thick film or thin film elements and their interconnections on a substrate, and then encapsulating discrete semiconductor chips, monolithic integrated circuits or mixed assembly of micro-components on the same substrate. Compared with discrete component circuits, hybrid integrated circuits have the characteristics of high assembly density, high reliability, and good electrical performance. Compared with monolithic integrated circuits, it has flexible design, convenient process, and is convenient for multi-variety and small-batch production; and it has a wide range of component parameters, high precision, good stability, and can withstand higher voltage and higher power.
Hybrid integrated circuits concentrate the functional parts of all components in a circuit on a substrate, which can basically eliminate the auxiliary parts in the Electronic Components and the assembly gaps and solder joints between the Electronic Components, thereby improving the assembly of PCBA electronic equipment Density and reliability. Because of this structural feature, the hybrid integrated circuit can be used as a distributed parameter network with electrical performance that is difficult to achieve by a discrete component network. Another feature of hybrid integrated circuits is to change the sequence, thickness, area, shape and properties of the three films of conductor, semiconductor and dielectric and their lead positions to obtain passive networks with different properties.
