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Qianli 3D IC Chip BGA Reballing Stencil Kit Tin Plant Net Solder Heating Template for IP XS 8 7 6S 6 5S 5

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Qianli 3D IC Chip BGA Reballing Stencil Kit Tin Plant Net Solder Heating Template for IP XS 8 7 6S 6 5S 5

$153.38

5-9
Pieces
$145.71

10-19
Pieces
$138.04

20-49
Pieces
$122.7

≥50
Pieces

5 Piece/Pieces (Min. Order)

option:

Full Set

Quantity:

0 Piece，Product Price: US $ 0

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Product Description

Overview

Product Attributes

Model Number:: Qianli Golen Bga Reballing Stencil

Application:: For Iphone Xs 8 7 6 5 Ic Chip Reballing

Origin:: Cn(Origin)

Particle Size:: 1-10μm

Place of Origin:: CN

Packaging & Delivery

Selling Units:: Piece/Pieces

Single package size:: 40cm*30cm*20cm

Single gross weight:: 1kg

Lead Time :

Quantity（Piece/Pieces）	1 ~ 1000	>1000
Est. Time（days)	7	To be negotiated

If you finish the payment today, your order will ship out within the delivery date.

Qianli IC Chip BGA Reballing Stencil Kit Tin Plant Net Solder Heating Template for iPhone XS 8 7 6S 6 5S 5

100% brands new and high quality

Multiple Types Available

FAQ

Who pay the duty for the order

All of the order based on DDU term, all of the import duty on buyer's account

When will the order be shipped ?

Normally we will ship out in 48 hours

When can I receive my order

If you chose China Post air mail, normally iit will spend 18-35 days ,if send out by DHL，it will arrived in 7 days

Related Keywords

Welding Fluxes, Tools, Cheap Welding Fluxes

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