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Home > Tools & Hardware > Power Tools > Power Cultivators > Corded Cultivators (SPU) > 1 Bottles BGA Reballing Balls ...
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  • Shipping time / days
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  • 0 Piece/Pieces $ 0
  • ship to United States To Be Negotiated $ /
  • Lead time / days
    After payment is complete, your order will ship within
  • Shipping time / days
    Estimated Delivery Time is the time between your package shipped out of carriers’ warehouses and final destination delivery. Estimated delivery time does not include supplier manufacturing lead time, holidays and weekends.
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1 Bottles BGA Reballing Balls (0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools
  • 1 Bottles BGA Reballing Balls (0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools
  • 1 Bottles BGA Reballing Balls (0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools
  • 1 Bottles BGA Reballing Balls (0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools
  • 1 Bottles BGA Reballing Balls (0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools
  • 1 Bottles BGA Reballing Balls (0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools
  • 1 Bottles BGA Reballing Balls (0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools
  • 1 Bottles BGA Reballing Balls (0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools
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1 Bottles BGA Reballing Balls (0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools

  • $5.92
    5-9
    Pieces
  • $5.62
    10-19
    Pieces
  • $5.33
    20-49
    Pieces
  • $4.74
    ≥50
    Pieces
5 Piece/Pieces (Min. Order)
Quantity:

0 Piece,Product Price: US $ 0

  • Lead Time:/ days
  • Shipping time:/ days
  • Product Description
Overview
Product Attributes
Origin:
Cn(Origin)
Application:
Bga Reballing
Model Number:
Best-505
Material:
Tin
Usage:
For Ic Chip Bga Smd Pga Pcb
Feature:
Welding Tools Accessories
Particle Size:
25-48μm
Balls Alloy:
Sn63/Pb37
Weight:
10 G/Bottle
Type 1:
Solder Ball
Use as:
Solder Tin
Flux content:
63(%)
Number:
25000pcs/Bottle
Place of Origin:
CN
Packaging & Delivery
Selling Units:
Piece/Pieces
Single package size:
40cm*30cm*20cm
Single gross weight:
1kg
Lead Time :
Quantity(Piece/Pieces) 1 ~ 1000>1000
Est. Time(days) 7To be negotiated

If you finish the payment today, your order will ship out within the delivery date.

1 Bottles BGA Reballing Balls (0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 ) BGA Solder Ball leaded For BGA Rework Repair Tools

 

Description:

  • Brand new and high quality.
  • Solder (Tin) paste is the best choice of reballing IC.  
  • It is used instead of the pin in the IC component package structure. 
  • Please Note: There are 25000Pcs/Bottle.The size of the bottle is fixed.The bigger the Reballing Balls, the more loaded it is.If it is a small Reballing balls,     the product will only occupy a small space for the bottle.    
 
Specificaton: 
  • Size: 0.2mm~0.65 mm 
  • Quantity: 25,000PCS per Bottle
  • Condition: Brand New
  • Balls Alloy: Sn63/Pb37
  • Standard: RoHs Available & SGS Tested
 
What's in the Package:
  • 1 x Reballing Balls

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