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Kaisi BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template

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Kaisi BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template

$53.98

5-9
Pieces
$51.28

10-19
Pieces
$48.58

20-49
Pieces
$43.18

≥50
Pieces

5 Piece/Pieces (Min. Order)

option:

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0 Piece，Product Price: US $ 0

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Product Description

Overview

Product Attributes

Origin:: Cn(Origin)

Certification:: None

Model Number:: Bga Reballing Stencil Kits

Brand Name:: Noenname_null

Particle Size:: 1-10μm

application:: For Huawei Bga Reballing Stencil Kits

application 2:: For Xiaomi Bga Reballing Stencil Kits

application 3:: For Oppo Bga Reballing Stencil Kits

application 4:: For Meizu Bga Reballing Stencil Kits

application 5:: For Lg Bga Reballing Stencil Kits

application 6:: For Samsung Mtk Bga Reballing Stencil Kits

application 7:: For Ic Power Bga

Brand Name:: NoEnName_Null

Place of Origin:: CN

Packaging & Delivery

Selling Units:: Piece/Pieces

Single package size:: 40cm*30cm*20cm

Single gross weight:: 1kg

Lead Time :

Quantity（Piece/Pieces）	1 ~ 1000	>1000
Est. Time（days)	7	To be negotiated

If you finish the payment today, your order will ship out within the delivery date.

Kaisi BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template

--High Quality Stainless Steel BGA Reballing Stencil.

--Specially Designed for HUAWEI XIAOMI LG OPPO MEIZU Samsung MTK MAX WTR

--Make your repair work easier.

--Color : Silver

--Feature : Square Hole

--We promised all the plate boards are in Brand New condition,but this item is easy to get scratched.

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Cheap Welding Fluxes, Welding Fluxes, Tools

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