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What are the advantages of metal core boards?
The continuous increase in the specifications of electronic products has led to the widespread application of large-scale originality electronics IC and Surface-Mount (SMT) & BGA Assembly in modern electronic manufacturing services. In addition, the circuit has been developing in the direction of miniaturization, light weight, multi-function, high performance, high speed and high reliability. The constant expansion of the component density leads to a gradual increase in the heat flux density. As far as semiconductor devices are concerned, excessively high temperatures may cause changes in electrical properties. Whenever T j (junction temperature) rises once, it will cause thermal breakdown if severe. If the thermal problem is not properly resolved, the component specifications will definitely be affected by instability, further reducing the stability and reliability of the product, while hanging in the air. In short, the thermal problems of printed circuit boards (PCBs) are so prominent that special attention must be paid to them for the high performance of electronic products.
• Introduction to MCPCB
With the continuous development and optimization of material science and processing technology, MCPCB has been widely used in the United States and Japan. Under the same external application environment, the performance of MCPCB in terms of heat dissipation is better than any other type of PCB board, representing the high level of global high-power electronic components.
MCPCB utilizes thermally conductive metals, such as copper, in certain layers of multilayer PCBs. MCPCB dissipates heat from the outside through the metal core, or realizes rapid heat dissipation by connecting with an external heat sink. When it comes to HDI PCBs, PCB boards compatible with SMT components, or circuits with so many Through-Hole Assembly assembled, MCPCBs with high thermal conductivity must be picked up. First, a metal core with good heat dissipation is embedded in a multi-layer PCB, and the multi-layer PCB can be connected through a plated through hole, and the plated through hole can conduct heat on the metal core and its surface.
Compared with the traditional heat dissipation mode, MCPCB has unparalleled heat dissipation advantages. MCPCB can increase the power density of products and reduce the need for assembling heat sinks and other hardware. In addition, with the decline in hardware and assembly costs, the product volume may shrink. Finally, MCPCB has played an active role in improving product reliability and shielding electromagnetic waves, reducing electromagnetic interference.
Due to the high copper density, the quality of MCPCB is significantly better than any other type of PCB. However, because the heat sink and accessories usually equipped on other types of PCBs are less used, the application of MCPCB will not bring higher weight. When deciding to use MCPCB, you may encounter two tips about MCPCB:
Tip 1: Choose the appropriate copper core thickness;
Tip 2: You can also choose Aluminum base board.