What is the SMT manufacturing process?
SMT processing technology is surface mount technology (abbreviation of Surface Mounted Technology), which is currently the most popular technology and process in PCBA Manufacturing industry.
What are the characteristics of SMT:
1. High assembly density, small size and light weight of electronic products. The volume and weight of SMT Electronic Components are only about 1/10 of that of traditional plug-in components. Generally, after SMT is adopted, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced. 60%~80%, pcb over 99.6% Satisfied rate.
2. High reliability and strong anti-vibration ability. The defect rate of solder joints is low.
3. Good high frequency characteristics. Reduce electromagnetic and radio frequency interference.
4. It is easy to realize automation and improve production efficiency. Reduce costs by 30%~50%. Surface-Mount (SMT) &BGA Assembly can save materials, energy, equipment, manpower, time, etc.
3. Why use SMT:
1. Electronic products are pursuing miniaturization, and the previously used perforated plug-in Electronic Components can no longer be reduced
2. Electronic products have more complete functions, and the originality electronics IC used has no perforated components, especially large-scale, highly integrated ICs, which have to use surface mount components.
3. With mass production of products and automation of production, the factory must produce high-quality products with low cost and high output to meet customer needs and strengthen market competitiveness.
4. The development of Electronic Components, the development of origin electronics IC, and the diversified application of semiconductor materials.
5. The electronic technology revolution is imperative, chasing the international trend. The basic SMT process components include: screen printing (or dispensing), placement (curing), reflow soldering, cleaning, inspection, and repair.
