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Originality electronics IC Parting Sourcing
  • Originality electronics IC Parting Sourcing
  • Originality electronics IC Parting Sourcing
  • Originality electronics IC Parting Sourcing
  • Originality electronics IC Parting Sourcing
  • Originality electronics IC Parting Sourcing
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Originality electronics IC Parting Sourcing

  • $1.6
    ≥1
    Piece/Pieces
1 Piece/Pieces (Min. Order)
Quantity:

0 Piece,Product Price: US $ 0

  • Lead Time:/ days
  • Shipping time:/ days
Sample:
$20.00 /Piece/Pieces, 5 Piece/Pieces (Max. Order)Buy Samples
  • Product Description
Overview
Product Attributes
Model No.:
Parting Sourcing 008
place of origin:
China
Operating Temperature:
-40°c ~ 85°c (Ta)
Mounting Type:
Surface Mount
Mfr:
Macronix
Package / Case:
8-Soic (0.209", 5.30mm Width)
Memory Size:
128mb (16m X 8)
Voltage - Supply:
2.7v ~ 3.6v
Clock Frequency:
133 Mhz
Memory Interface:
Spi - Quad I/O, Qpi
Write Cycle Time - Word, Page:
40µs, 1.2ms
Packaging & Delivery
Selling Units:
Piece/Pieces
Single package size:
12cm*12cm*24cm
Single gross weight:
2kg
Package Type:
Vaccum and ESD
Picture Example:
Lead Time :
Quantity(Piece/Pieces) 1 ~ 2500>2500
Est. Time(days) 3To be negotiated

If you finish the payment today, your order will ship out within the delivery date.

How does IC work?

Electronic Components are a combination of diodes, Electronic Resistor and Capacitor, Electronic connectors and transistors in a minimized form on a wafer made of silicon. ... Transistors – These components Sourcing are used to store voltages or circuit stabilizer. They can be utilized to amplify the given signal and used as switches working in digital circuits.

Random access memory is the most common type of custom circuit board cost manufacturing, so the highest density device is memory, but even microprocessors have memory. Although the structure is very complex—chip widths have been decreasing for decades—the layers of integrated circuits are still much thinner than the width. The production of the component layer is very much like a photographic process. Although light waves in the visible spectrum cannot be used to expose component layers because they are too large. High-frequency photons (usually ultraviolet light) are used to create the pattern of each layer. Because each feature is very small, an electron microscope is an essential tool for a process engineer who is debugging a manufacturing process.
Before using automatic test equipment (ATE) packaging, each device must be tested. The testing process is called wafer testing or wafer probing. The wafers are cut into rectangular pieces, each called a "die". Each good die is soldered to the aluminum wire or gold wire on the "pads" and connected to the package, and the pads are usually on the side of the die. After packaging, the equipment undergoes final inspection on the same or similar ATE used in wafer probing. The cost of testing can reach 25% of the PCBA manufacturing cost of low-cost products, but it can be ignored for low-yield, large and/or high-cost equipment.

Electronic Ic Parting Sourcing 1 JpgElectronic Ic Parting Sourcing 2 JpgElectronics Ic Parting Sourcing JpgElectronics Ics Parting Sourcing 1 JpgElectronics Ics Parting Sourcing 2 Jpg

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