SMT Electronic Components PCB Assembly Service

                                                  Differences between SMT and DIP

1, DIP means packaging, also known as dual-in-line packaging technology, refers to the use of dual-in-line packaging of integrated circuit chips, the vast majority of small and medium-sized integrated circuits are used in this form of packaging, the pin number is generally not more than 100. A DIP packed CPU chip has two rows of pins that need to be inserted into a chip socket with a DIP structure.
2. The full name of DIP is Dual in-line Package.
3, SMT is the surface assembly technology (surface mount technology) it is the surface mount components affixed, welded to the printed circuit board surface on the specified position of the circuit assembly technology, the use of responsibility for the circuit board without the principle of drilling. Specifically, is the first coating solder paste on PCB circuit plate, then the SMT components accurately in the welding plate coated with solder paste, the printed circuit board by heating until the solder paste melting, cooling and then realize the interconnection between meta and PCB, is one of the most popular in the electronic assembly industry technology and process.
4. SMT stands for Surface Mounted Technology.