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Home > Electronic Components, Accessories & Telecommunications > PCB & PCBA > Multilayer PCB > Top 10 electronic pcb assembly
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  • 0 Piece/Pieces $ 0
  • ship to United States To Be Negotiated $ /
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  • Shipping time / days
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Top 10 electronic pcb assembly
  • Top 10 electronic pcb assembly
  • Top 10 electronic pcb assembly
  • Top 10 electronic pcb assembly
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Top 10 electronic pcb assembly

  • $1
    ≥1
    Piece/Pieces
1 Piece/Pieces (Min. Order)
option:
Quantity:

0 Piece,Product Price: US $ 0

  • Lead Time:/ days
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Sample:
$0.50 /Piece/Pieces, 1 Piece/Pieces (Max. Order)Buy Samples
  • Product Description
Overview
Product Attributes
Model No.:
smart electronics pcba
place of origin:
China
Number of layers:
4-Layer, 6-Layer, 8-Layer, 10-Layer, 12-Layer
Max BGA size:
70*70mm
BGA ball pitch:
1.00 To 3.00mm
0.4 to 1.0mm:
0.3
BGA ball diameter:
0.4 To 1.0mm
Max chip size:
1000*400mm
Packaging & Delivery
Selling Units:
Piece/Pieces
Single package size:
15cm*15cm*25cm
Single gross weight:
1kg
Package Type:
Vacuum and ESD Package
Lead Time :
Quantity(Piece/Pieces) 1 ~ 2000>2000
Est. Time(days) 3To be negotiated

If you finish the payment today, your order will ship out within the delivery date.

What is the difference between PCB and PCBA?



Turkey PCB Assembly generally refers to a processing process, which can also be understood as a finished circuit board, which means that PCBA can only be counted after the processes on the communication PCB board are completed. The PCB refers to an empty printed circuit board with no parts on it.

   With the high-speed, high-performance, and ultra-miniaturization of electronic equipment, packaging technology has developed rapidly. Chip size packages CSP and BGA packages are developing towards multiple terminals and narrow lead pitches, and bare chips (Bare
Chip) packaging has also been put into practical use. Due to the advancement of these packaging technologies, the printed circuit board PCB (BVH(buried/blind via hole)PCB) also put forward new requirements (to adapt to high-density packaging and high-speed requirements).


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