What is HDI in PCB?
HDI is the English abbreviation of High Density Interconnector, HDI High Quality PCB Products (HDI) manufacturing type Quickturn printed circuit board production Quickturn, PCB is a structural element formed by insulating materials and conductor wiring.
Since PCB is not a general terminal product, the definition of the name is a bit confusing. For example, Heavy copper board, Rogers PCB, and Ceramic PCB exist but are not the same. Therefore, when evaluating the industry, the two are related but cannot be said to be the same.
Under the premise that electronic products tend to be multi-functional and complex, the contact distance of integrated circuit components has been reduced, and the speed of signal transmission has been relatively increased. This is followed by an increase in the number of wiring and the locality of the length of the wiring between points. To shorten, these require the application of high-density circuit configuration and microvia technology to achieve the goal. Wiring and jumper are basically difficult to achieve for single and double panels, so the circuit board will be multi-layered, and because of the continuous increase of signal lines, more power layers and grounding layers are necessary means for design. All of these have made Multilayer Printed Circuit Board (Multilayer Printed Circuit Board) more common.
For the electrical requirements of high-speed signals, the circuit board must provide impedance control (Characteristic impedance PCB) with AC characteristics, high frequency transmission capability (High frequency board), and reduce unnecessary radiation (EMI). With the structure of Stripline and Microstrip, multi-layer design becomes a necessary design. In order to reduce the quality problems of signal transmission, insulating materials with low dielectric coefficient and low attenuation rate are used. To cope with the miniaturization and arraying of electronic components, the density of circuit boards is continuously increased to meet demand. The emergence of component assembly methods such as BGA (Ball Grid Array), CSP (Chip Scale Package), DCA (Direct Chip Attachment), etc., has promoted printed circuit boards to an unprecedented high-density state.
