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MECHANIC Solder Paste XG50 Sn63/Pb37 Solder Paste Flux 183C Melting Point Welding Flux Soldering Cream Mobile Phone PCB Repair

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MECHANIC Solder Paste XG50 Sn63/Pb37 Solder Paste Flux 183C Melting Point Welding Flux Soldering Cream Mobile Phone PCB Repair

$5.98

5-9
Pieces
$5.68

10-19
Pieces
$5.38

20-49
Pieces
$4.78

≥50
Pieces

5 Piece/Pieces (Min. Order)

Quantity:

0 Piece，Product Price: US $ 0

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Product Description

Overview

Product Attributes

Origin:: Cn(Origin)

Model Number:: Mechanic Bga Solder Flux Paste, Mechanic Solder Paste Flux Xg-50 Xg-Z40

Brand Name:: Mechanic

Particle Size:: 25-48μm

Usage:: Bga Pcb Repair Solder Flux Paste

Feature:: For Soldering Iron Circuit Board Repair

Feature 2:: Mechanic Xg-50 Xg-Z40

Brand Name:: MECHANIC

Place of Origin:: CN

Packaging & Delivery

Selling Units:: Piece/Pieces

Single package size:: 40cm*30cm*20cm

Single gross weight:: 1kg

Lead Time :

Quantity（Piece/Pieces）	1 ~ 1000	>1000
Est. Time（days)	7	To be negotiated

If you finish the payment today, your order will ship out within the delivery date.

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MECHANIC Solder Paste XG50 Sn63/Pb37 Solder Paste Flux 183C Melting Point Welding Flux Soldering Cream Mobile Phone PCB Repair

Product Features :

Advanced insulation technology, a high viscosity no-clean flux, it can be used for PCB, SMD reworking, as well as reballing of computer and phone chips.
The mixture of high-quality alloyed powder and resinic pasty flux, which avoid the pale yellow residue, so you are easy to clean the board.
Super compacity: Soldering paste for cell phone PCB, SMD, PGA and computer etc.
Help to repair the circuit boards and protect the electronic components
Flux Solder Paste - no clean soldering
Syringe solder paste is an ideal assistant for phone motherboard and repairing cell phone surface mount assemblies.
The syringe plunger will provide premium activity levels with maximum wetting and spreading, 10cc syringe is available for all rework soldering and desoldering repairs.
High quality, perfect performance, easy to weld.
Suitable for mobile phone repair industry, computer digital service industry, high-precision circuit board SMD welding, BGA welding technology and so on.

Product Specifications

Material: Tin+Solder Past
Type: BGA Soldering Tin Cream
Product: XG-50
Volume: 35G
Alloy: Sn63/Pb37
Design: Squeeze tube needle dispense
Microns: 20-38u
Application: Applicable to Phone PCB, BGA, SMD, PGA Repair
Usage: PCB BGA Repairing Tool
Function: Repair the Circuit Boards, Protect The Electronic Components
Is-customized: No

Related Keywords

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