Description:
The surface of the solder or the element is oxidized, it is not easy to adhere to the tin and the next welding, and the rosin can quickly remove the oxidation, making the component easier to pass the welding, the effect is obvious
Specifications:
Material: natural resin
Viscosity: 100 (Pa · S)
Granularity: 50 (um)
Melting point: 125 ° C
Neutral PH 7 ± 0.3
Size: 4.8 * 2.2 * 2cm (length * width * height)
Feature:
100% new brand and high quality
Good flux effect and high joint strength
Good insulation
Non-corrosive, non-corrosive to IC and PCB
Smooth welding surface
No deterioration, no drying
Package Included:
2Pcs/lot x 15g high purity solid rosin solder paste