Five-channel temperature reflow machine T-960W 4.5 KW 0-1500mm/min Single reflow soldering welding machine

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Description:

• Model:T-960W

• Heating zone:5

• Heating length:960mm

• Heating Method:Infrared strengthen the system of hot air

• Cooling zone number:1

• PCB Max width:300MM

• Conveyor direction:Left to right

• Transport system:Network transmission and chain drive

• Conveyor speed:0-1500mm/min

• Power:50/60Hz

• Average Power:4.5 KW

• warming up time:About 15 minutes

• Temperature control range:At room temperature to 350 degrees

• Temperature Control:PID closed-loop control

• Temperature Accuracy:plus or minus1 degrees

• PCB board Temperature distributed deviating :plus or minus 2 degrees

• Dimensions:1450*630*470mm

• Machine weight:96KG 

Operating instructions:

1.After startup Settings into the interface. Press F2 to curve selection, according to F1 point selection, press F3 / F4 set the corresponding zone temperature move up/down, press F5 to enter heating interface;

2.Five little red switch 1/2/3/4/5 each control on the temperature range of the first/on the temperature range of the temperature range of the first/second/third area/second temperature area;

3.Open the motor switch temperature balance, and adjust the belt speed;

4.Press F2 to stop heating, and enter the setting interface;

5.Each USES a temperature curve are as follows:

a.Curve 1, 2, suitable for welding of lead less solder; Such as: 85 sn/pb 15 70 sn/pb 30, etc.;

b.Curve of 3, 4, more suitable for welding of lead solder; Such as: 63 sn / 37 pb sn/pb 40 60, etc.;

c.Curve 5, 6, suitable for high melting point lead-free solder welding; Such as: Sn/Ag3.5; Sn/Cu. 75 Sn/Ag4.0 / Cu. 5 Sn95.5 Ag3.8 / Cu0.7, etc.;

d.Curve 7, 8, suitable for welding of lead-free solder melting point; Such as: Sn/Ag2.5 / Cu. 8 / Sb. 5. Sn/Bi3.0 Ag3.0, etc.;

e.Curve 1, 3, 5, 7 480 s recommended veneer welding cycle, curve 2, 4, 6, 8 280 s recommended veneer welding cycle.

Special remind

1.When the welding chip, according to the requirements of the chip size and welding process, selection of an appropriate curve

2.Heating temperature, the distribution of the top three area, lower 2 area, corresponding to the heating curve of the first/second/third/fourth paragraphs / 5 paragraphs.

3.There are many kinds of, at present the production and use of solder each company chooses is not the same, the theoretical analysis and the analysis of the test article very much. For these reasons, the company launched the product can be preset eight curve, each a curve has five section, every period of heating time can change. Users can according to the heating temperature and the time required for solder from the new set the heating curve.