Kafuter 80g k-5203 LED thermal conductive silicone CPU bonding adhesive thermal silica coefficient 1.2 white

Features:

This product is a neutral through reinforced silicone elastomer gel, both bonding effect, and good thermal conductivity (heat), thermal effect is excellent, with good resistance to high temperature curing adhesive Changes performance, long-term use will not fall off, no contact with the gap, the cooling effect is not reduced.

Uses:

mainly used in CPU and heat sink, intelligent control thyristor module and heat sink filled with adhesive, electrical power between the module and the heat sink. After this glue can be removed with traditional cards and screw connections, the result is to bring more reliable filling cooling, simpler process, more economical cost.

Instructions:

1, will be sticky or coated finishing clean, remove rust, dust and oil and so on.

2, unscrew the hose cap, the glue to the clean surface, so that distribution will be sticky surface close fixed.

3, will be glued or sealed parts in the air, let it cure. Curing process is a cure from the surface to the internal process within 24 hours (room temperature and 55% relative humidity) glue curing depth of 2-4mm.