GOOT suction line 1515/2015/2515/3015/3515 absorbing and welding woven BGA solder stripping core wicking braided wire welding parts
Introduction
1. It is made of pure copper and special chemicals to ensure good, fast and save time.
2. Used to remove excess solder during tin removal, resistant to oxidative corrosion, thermal conductivity, tinning effect is very good, and the tin is clean.
3. The tin strip is a wire braid that can absorb molten solder by capillary action. It is used to remove excess solder during tin removal, resist oxidation and corrosion, and has good thermal conductivity and good tin absorption. The motherboard re-soldering point is removed and used in conjunction with the soldering station.
The tin strip is made of pure copper and special chemical formula to ensure fast, good and economical. It is used to remove excess solder during tin removal, resist oxidation and corrosion, and has good thermal conductivity and good tin absorption. In desoldering, after the chip is removed, there will be a large amount of solder on the board, which will affect the soldering of the chip. Usually, the tin strip is cleaned by placing the soldering iron on the tin strip and slowly moving it on the die pad. When the solder is melted, it will be sucked up by the tin strip, sucking the tin between the feet, thus cleaning up. The seesaw is very clean. After that, it is best to wash the board chip position thoroughly with the washing water. The tin strip can be used to compare larger patch components! In the tin removal tool, the solder can be used for general aluminum electrolytic capacitors, etc. The tin strip can be used to compare larger patch components. No-cleaning, the section that has been sucked off after each use can be reused.
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