0 Piece,Product Price: US $ 0
Quantity(Piece/Pieces) | 1 ~ 2000 | >2000 |
Est. Time(days) | 7 | To be negotiated |
If you finish the payment today, your order will ship out within the delivery date.
Features:
Suitable for BGA ball, semiconductor packaging, repair.
Computer motherboard north and south bridge, communications, graphics and other BGA apply.
Just apply a little each time.
It's currently the best on the market BGA, CSP rework help paste.
When the bumping of the BGA chip coated with flux paste and PCB pads are required coat.
Good BGA soldering flux paste and machine regardless of manual welding, the success rate is greatly increased.
Specification:
Material: tin+solder paste
Color: As picture shown
Capacity: 10cc/10ml
Size: Approx. 1.30*1.30*1.14inch / 3.3*3.2*2.9cm
Type: 2pc NC-559-ASM-UV 559 (as the photo show)
Package include:
2 x 10cc NC-559-ASM
1 x Syringe push
2x Blunt end tip