Scope of application:
High strength,
Fast bonding effect,
Suitable for all kinds of components, LEDs and heat sinks that need to be directly bonded firmly, etc.)
Packing specification:
5Gram/support,
The package is airtight and the jacket vacuum bag isolates the air and increases the storage time.
Product performance:
It is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation. The product has good conductivity and a wide temperature range (-60~200°C).Short-term resistance to 300 ° C high temperature. In addition, it has a short surface curing time, strong adhesion, long storage period, non-toxic, solvent-free, and can be safely applied to electronics.Elastic bonding, heat dissipation, insulation and packaging of electrical appliances, instruments, LEDs, heat sinks and other industries.
Instructions:
1When using, directly extrude the product, rub the surface of the adherend, and cover it immediately after use, in case of trial again;
2The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa;
3It is recommended to apply the thickness: 0.1-0.5mm, the thinner the better.
4Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean.
Qualcomm Star (ST922) 5g New viscous thermal silica gel, many small heat sink fixing methods are sticky, it depends on this glue to stick. 5 grams per bottle. It is more tightly bonded than a paste method (double-sided thermal paste), and the heat conduction is better.
Product performance:
It is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation. The product has good thermal conductivity, wide temperature range (-60-200 °C) and short-term resistance to 300 °C. In addition, it has short surface curing time, strong adhesion, long shelf life, non-toxic, solvent-free, and can be safely applied in the elastic bonding, heat dissipation, insulation and packaging of electronics, electrical appliances, instruments and other industries.
Instructions:
1. When using, directly extrude the product, rub it on the surface of the adherend, and cover it immediately after use, in case it is used again;
2. The surface curing speed is related to the relative humidity and temperature in the air: the higher the temperature, the faster the curing speed, and vice versa;
3. Recommended thickness: 0.1-0.5mm, the thinner the better.
4. Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean.
