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Home > Agriculture > Fresh Vegetables > Fresh Scallions > Japan Steel BGA Stencil for BG...
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  • Shipping time / days
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  • 0 Piece/Pieces $ 0
  • ship to United States To Be Negotiated $ /
  • Lead time / days
    After payment is complete, your order will ship within
  • Shipping time / days
    Estimated Delivery Time is the time between your package shipped out of carriers’ warehouses and final destination delivery. Estimated delivery time does not include supplier manufacturing lead time, holidays and weekends.
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Japan Steel BGA Stencil for BGA EMCP/EMMC IC chip Reballing Planting Tin Net Repair Tools
  • Japan Steel BGA Stencil for BGA EMCP/EMMC IC chip Reballing Planting Tin Net Repair Tools
  • In Stock
  • Ready to Ship
  • Fast Dispatch

Japan Steel BGA Stencil for BGA EMCP/EMMC IC chip Reballing Planting Tin Net Repair Tools

  • $16.76
    5-9
    Pieces
  • $15.92
    10-19
    Pieces
  • $15.08
    20-49
    Pieces
  • $13.41
    ≥50
    Pieces
5 Piece/Pieces (Min. Order)
option:
Quantity:

0 Piece,Product Price: US $ 0

  • Lead Time:/ days
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  • Product Description
Overview
Product Attributes
Model Number:
Emmc2
Material:
Japanese Steel
Particle Size:
25-48μm
Packaging & Delivery
Selling Units:
Piece/Pieces
Single package size:
40cm*30cm*20cm
Single gross weight:
1kg
Lead Time :
Quantity(Piece/Pieces) 1 ~ 1000>1000
Est. Time(days) 7To be negotiated

If you finish the payment today, your order will ship out within the delivery date.

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